QualificationExact sourced interface · installation and in-situ harvest unqualified
ArticleP124 · monocrystalline · series count not documented
Open circuit / short circuit7.25 V · 220 mA @ 1000 W/m² AM1.5G
Operating point · theoretical6.11 V × 210 mA = 1.29 W @ 1000 W/m² AM1.5G
Operating point · expected5.89 V × 180 mA = 1.09 W @ 1000 W/m² AM1.5G · 7.04 V open circuit
Module113 × 66 × 2.9 mm · 31.6 g
Active areaNot documented by the manufacturer; module footprint is not substituted
Terminationsolder-pads
Geometry authority: manufacturer-cad
Datum: Rigidly rebased manufacturer CAD: lower envelope corner at the origin; +X is 113 mm panel length, +Y is 66 mm width, +Z is thickness toward the sun-facing surface.
The committed solid is tessellated manufacturer CAD and preserves its 113 × 66 × 2.9 mm envelope without scaling. The datasheet separately calls the nominal panel 2.6 mm thick with ±0.5 mm standard dimensional tolerance. The matching G108 catalog record owns the mounting-gasket outline and nominal thickness; finished wire, solder joint, strain relief, installed VHB compression, roof curvature, wiring keep-out, and substrate adhesion remain consumer-owned and physically unvalidated.